The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems. Microsystems packaging, systems integration, flexible electronics, materials with nano structures and in general small scale systems packaging are areas of growing interest for the Journal. Originality, scientific merit and high engineering relevance are the major criteria for the acceptance of a submitted paper.